Analyst Chris Miller argues China's core challenge is manufacturing, as it lacks the advanced lithography tools monopolized by ASML. The US and Taiwan are projected to produce 30 times more quality-adjusted AI chips, a gap unlikely to close soon.

Reports of China building a working EUV lithography machine are misleading. The effort appears to be an assembly of smuggled components from ASML's existing supply chain, not a story of domestic innovation. This frames the primary challenge as one of export control evasion rather than a rapid technological leap by China.

Instead of crippling China, aggressive US sanctions and tech restrictions are having the opposite effect. They have forced China to accelerate its own domestic R&D and manufacturing for advanced technologies like microchips. This is creating a more powerful and self-sufficient competitor that will not be reliant on the West.

To accelerate progress and maintain a competitive lead over China, John Martinis's new company is partnering with Applied Materials. They are leveraging modern, 300mm semiconductor fabrication tools—which are restricted from China—to build next-generation quantum devices with higher quality and scalability.

Contrary to their intent, U.S. export controls on AI chips have backfired. Instead of crippling China's AI development, the restrictions provided the necessary incentive for China to aggressively invest in and accelerate its own semiconductor industry, potentially eroding the U.S.'s long-term competitive advantage.

The US ban on selling Nvidia's most advanced AI chips to China backfired. It forced China to accelerate its domestic chip industry, with companies like Huawei now producing competitive alternatives, ultimately reducing China's reliance on American technology.

By 2030, China is expected to have a fully indigenous DUV lithography supply chain, enabling mass production of chips on older process nodes. However, for the most advanced EUV technology, they will likely only have working prototypes and will still be struggling with the 'production hell' required for high-volume manufacturing.

China's semiconductor strategy is not merely to reverse-engineer Western technology like ASML's. It's a well-funded "primacy race" to develop novel, AI-driven lithography systems. This approach aims to create superior, not just parallel, manufacturing capabilities to gain global economic leverage.

The effectiveness of US export controls on advanced AI chips stems from a deep technological gap. According to China's own projections, it won't be able to domestically produce chips as powerful as those the US is restricting until 2028, creating a significant and lasting strategic advantage for democracies.