Unlike past cycles driven solely by new demand (e.g., mobile phones), the current AI memory super cycle is different. The new demand driver, HBM, actively constrains the supply of traditional DRAM by competing for the same limited wafer capacity, intensifying and prolonging the shortage.

The next wave of AI silicon may pivot from today's compute-heavy architectures to memory-centric ones optimized for inference. This fundamental shift would allow high-performance chips to be produced on older, more accessible 7-14nm manufacturing nodes, disrupting the current dependency on cutting-edge fabs.

The primary bottleneck for increasing DRAM supply is a "clean room constraint"—a physical shortage of space in existing fabs to install new manufacturing equipment. This limitation means that even with massive investment, significant new wafer capacity is unlikely to come online meaningfully before 2028.

For companies like NVIDIA or Google, moving from TSMC to Intel or Samsung is not a simple supplier switch. It necessitates a complete redesign of the chip's architecture to fit the new foundry's technology. This complex and costly process can take one to two years, making it a last resort.

The AI industry's growth constraint is a swinging pendulum. While power and data center space are the current bottlenecks (2024-25), the energy supply chain is diverse. By 2027, the bottleneck will revert to semiconductor manufacturing, as leading-edge fab capacity (e.g., TSMC, HBM memory) is highly concentrated and takes years to expand.

While energy supply is a concern, the primary constraint for the AI buildout may be semiconductor fabrication. TSMC, the leading manufacturer, is hesitant to build new fabs to meet the massive demand from hyperscalers, creating a significant bottleneck that could slow down the entire industry.

Producing specialized High-Bandwidth Memory (HBM) for AI is wafer-intensive, yielding only a third of the memory bits per wafer compared to standard DRAM. As makers shift capacity to profitable HBM, they directly reduce the supply available for consumer electronics, creating a severe shortage.

Despite record profits driven by AI demand for High-Bandwidth Memory, chip makers are maintaining a "conservative investment approach" and not rapidly expanding capacity. This strategic restraint keeps prices for critical components high, maximizing their profitability and effectively controlling the pace of the entire AI hardware industry.

Despite record capital spending, TSMC's new facilities won't alleviate current AI chip supply constraints. This massive investment is for future demand (2027-2028 and beyond), forcing the company to optimize existing factories for short-term needs, highlighting the industry's long lead times.