Unlike past cycles driven solely by new demand (e.g., mobile phones), the current AI memory super cycle is different. The new demand driver, HBM, actively constrains the supply of traditional DRAM by competing for the same limited wafer capacity, intensifying and prolonging the shortage.

The growth of AI is constrained not by chip design but by inputs like energy and High Bandwidth Memory (HBM). This shifts power to component suppliers and energy providers, allowing them to gain leverage, demand equity, and influence the entire AI ecosystem, much like a central bank controls money.

The memory shortage is forcing real-world consequences as consumer electronics firms are already raising PC prices (Dell, Lenovo) and cutting smartphone sales forecasts (MediaTek). Companies are also delaying new product launches to avoid passing on higher component costs to consumers.

The AI industry's growth constraint is a swinging pendulum. While power and data center space are the current bottlenecks (2024-25), the energy supply chain is diverse. By 2027, the bottleneck will revert to semiconductor manufacturing, as leading-edge fab capacity (e.g., TSMC, HBM memory) is highly concentrated and takes years to expand.

With new factory capacity years away, the only immediate lever for increasing DRAM supply is "node migration." This involves shifting production to more advanced manufacturing processes (like 1B and 1C) that can produce more memory bits per silicon wafer. The speed of this migration is the critical factor for easing supply.

The critical constraint on AI and future computing is not energy consumption but access to leading-edge semiconductor fabrication capacity. With data centers already consuming over 50% of advanced fab output, consumer hardware like gaming PCs will be priced out, accelerating a fundamental shift where personal devices become mere terminals for cloud-based workloads.

Unlike standard DRAM where products are standardized, HBM is less of a commodity. The complexity of manufacturing HBM—stacking multiple dice and advanced packaging—allows suppliers to differentiate on technology, yield, and thermal performance, giving them a competitive edge beyond just price.

In a surprising market inversion, the price surge for commodity DRAM has become so extreme that its profit margins now exceed those of specialized High-Bandwidth Memory (HBM). This creates a strategic dilemma for producers, forcing them to balance short-term profits against long-term AI market position.

Despite record profits driven by AI demand for High-Bandwidth Memory, chip makers are maintaining a "conservative investment approach" and not rapidly expanding capacity. This strategic restraint keeps prices for critical components high, maximizing their profitability and effectively controlling the pace of the entire AI hardware industry.